Number of layers: Single side to 8 layers
Materials: XPC, FR1, FR2, FR4, CEM-1,Aluminium Based PCB
Smaillest hole size:0.010" (0.25mm)
Board thinckness:0.024" to 0.094" (0.6mm to 2.4mm)
Surface finish: Lead-free HASL, Immersion Gold, Flash Gold, Entek
Copper thickness:1-3 oz
Minimum line and ***ce:4 mil/4mil
UL file: E77787
ISO 9001 and TS-16949